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  • Depositing a chemical metal layer on the surface of the printed circuit, the color is stable, the brightness is good, the plating layer is flat, and the solderability of the nickel-gold plating layer can be basically divided into four stages: pretreatment (degreasing, micro-etching, activation, post-dipping ), immersion of nickel, immersion of gold, post-processing (waste gold washing, drying.

  • The principle of electrolysis is the method of laying a layer of metal on the conductor, which can enhance the corrosion resistance of the metal (the coating metal is mostly corrosion-resistant metal), increase the hardness, prevent abrasion, improve the conductivity, smoothness, heat resistance and surface Beautiful.

  • Depositing a chemical metal layer on the surface of the printed circuit, the color is stable, the brightness is good, the plating layer is flat, and the solderability of the nickel-gold plating layer can be basically divided into four stages: pretreatment (degreasing, micro-etching, activation, post-dipping ), immersion of nickel, immersion of gold, post-processing (waste gold washing, drying.

  • The temperature of the leaded eutectic is lower than that of lead-free. The specific temperature difference, mechanical strength and brightness are determined by the alloy composition. Lead-free is better than lead-free in terms of brightness.

  • Depositing a chemical metal layer on the surface of the printed circuit, the color is stable, the brightness is good, the plating layer is flat, and the solderability of the nickel-gold plating layer can be basically divided into four stages: pretreatment (degreasing, micro-etching, activation, post-dipping ), immersion of nickel, immersion of gold, post-processing (waste gold washing, drying.

  • Depositing a chemical metal layer on the surface of the printed circuit, the color is stable, the brightness is good, the plating layer is flat, and the solderability of the nickel-gold plating layer can be basically divided into four stages: pretreatment (degreasing, micro-etching, activation, post-dipping ), immersion of nickel, immersion of gold, post-processing (waste gold washing, drying.

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