The product information

Eight layer PCB design case of computer motherboard


Eight layer PCB design case of computer motherboard

1. Signal layer (top)

The first signal layer, also known as the top layer, is a layer for electronic components. It can be seen from the above figure that there are many wiring on this floor. One of the reasons is that the electronic components are placed on the same layer, and there is no need to set a via conversion layer in the wiring process. This prevents vias from blocking the routing of other layers. Instead, pay attention to the setting of vias in multilayer board wiring.

2. Power supply layer (VCC)

No routing is seen on this floor. Because this layer is a power network. In the design, a specific line is used for power division. On the premise that the electronic components with the same voltage need to be placed in one area during the layout of electronic components and connected to the same area of this layer through vias, so there is no need to route.

3. Inner layer3

This floor mainly runs signal lines, followed by some power lines. The larger one in the figure below is the power line, and the smaller one is the signal line.

4. Inner layer4

The layout of this floor is basically the same as that of the previous floor. The routing is signal line and power line.

5. GND layer

This layer is the GND network layer, which is connected through vias.

6. Signal layer (inner layer5)

7. GND layer

The picture is omitted.
This floor is the same as the fifth floor.

8. Bottom layer

This floor is the same as the top floor. Many small chips are basically wired on the top layer or this layer.